Presentation
| Product range | CT60 |
| Product type | BGA Balls |
Sale package
| Pack | Bulk |
| Content | BGA Balls |
| Product status | New |
BGA Balls Lanrui CT60
The Lanrui CT60 BGA balls represent the professional and high-precision solution ideal for repairing and maintaining the pads on the motherboards
of iPhone phones. This remarkable set provides you with 25,000 pieces of solder balls with a perfect spherical shape, ensuring
complete uniformity of size and consistent performance during delicate service processes for touchscreens or chips.
Manufactured according to top industrial standards, the balls stand out with an extremely strict tolerance of only 8 microns,
far exceeding the usual market standard and offering flawless coverage for each pad individually.
The eco-friendly metallic material contains special trace elements that enhance solder quality,
and the native antistatic properties protect sensitive electronic components
against accidental electrical discharges.
