Presentation
| Product range | RL-407 |
| Product type | Thermal Paste |
Sale package
| Pack | Bulk |
| Content | Thermal Paste |
| Product status | New |
Relife RL-407 Thermal Paste - Pink
Relife RL-407 thermal paste is designed for efficient heat transfer between electronic components and cooling systems,
suitable for a wide range of applications. It can be used on iOS and Android mobile phones, laptops, desktop PCs, CPU and GPU processors,
video cards, modules with high thermal dissipation requirements, high-speed SSDs, network equipment, cooling devices, electronic
components, office equipment, and household appliances. With a thermal conductivity of 6.0 W/mK, the paste easily handles the high temperatures
generated by high-power processors. Its formula is resistant to heat, humidity, and aging, providing stable long-term performance.
At the same time, it has insulating properties, is electrically non-conductive, and does not corrode cooling system components.
Due to its low deformability and good plasticity, Relife RL-407 is easy to apply, efficiently fills microscopic gaps, and has
low fluidity, preventing unwanted leaks and ensuring optimal contact between surfaces.
Features:
- Thermal conductivity: 6.0 W/mK
- Compatible with phones, laptops, PCs, CPUs, GPUs, video cards, SSDs, and other components
- Resistant to heat, humidity, and aging
- Electrically non-conductive and non-corrosive
- Low fluidity, good plasticity
- Ensures efficient gap filling for optimal thermal dissipation